国家/地区 美国（25）
IPC部 B（25）
IPC大类 B32（25）
IPC小类 B32B（25）
IPC C08K003/04（12） B32B027/08（6） B32B005/02（5）
B32B027/18（5） B32B027/34（5） C08J005/18（5）
C08K003/34（5） B32B007/12（4） B32B009/00（4）
B32B015/08（4） B32B027/00（4） B32B027/20（4）
B32B033/00（4） C08K007/06（4） C09D007/61（4）
发明人 HEO C（2） HEO C H（2） HEO J H（2）
KANG T（2） KANG T W（2） KANGTAEWOON（2）
KIM Y S（2） PARK Y（2） PARK Y S（2）
SOON P Y（2）
公开年 2021（25）
申请年 2020（11）  2021（9）  2019（5） 
专利权人 HANKOOK ALUM.（2） KOREA ALUMIN.（2） UNIV SUNGKYU.（2）

Making lightweight armor involves grinding particles of rare-earth material to particle size, mixing with positively charged aqueous dispersion to create slurry, admixing slurry to silica gel, sublimating, and deposing nanoparticles.

WHARTON M T

Composition used for forming e.g. pipe, comprises resin and graphene material.

LADISLAUS P, ARMSTRONG N

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Filter used in device e.g. mask, breathing apparatus and face covering, vent cover and heating, ventilation, has polyurethane-based polymer foam comprising virucidal/bactericidal agent having cetylpyridinium chloride and/or dimethyloctadecyl(3-(trimethyloxysilyl)propyl)ammonium chloride.

RAMAPPA D A, JOGIKALMATH G

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Fiber polymer composite used for forming reinforced articles such as flexible tapes for e.g. car doors, mud guards, bumpers and engine covers, comprises fibers of material and matrix material which is in direct contact with at least some of fibers and comprising amorphous poly-(alpha)-olefin.

CEPA S, KARGERKOCSIS J, BARANY T, VARGA L J, BABIK S, MONDRZYK S, SPITZER U, EBBERS A, KARGERKOCSIS A, KARGERKOCSIS V, JOSEPH K, BARANITAMAS, BARGARASLOJOZEF, CHICJABRINA M, SPITZERUDO

Manufacturing laminated polyester film for e.g. tape, by mixing mechanically recycled polyester pellet and chemically recycled polyester pellet containing electrostatic adhesion additive, melting, forming polyester film layer and laminating.

LIAO T, YANG W, YANG C, HSIAO C, YUAN C

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Transferring graphene involves forming graphene on first substrate, forming polymer precursor mixture on second substrate, providing graphene oppositely to second substrate having polymer precursor mixture.

GU T J, JANG W, SEO Y, WHANG D, WHANG D M, SEO Y M, JANG W S

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R