国家/地区 美国（110）
IPC部 B（110）
IPC大类 B32（110）
IPC小类 B32B（110）
IPC C08K003/04（64） B32B009/00（36） C01B031/04（27）
B82Y030/00（24） C01B031/02（22） C08J005/18（22）
B32B027/18（19） C08L101/00（18） B32B027/08（17）
B82Y040/00（16） B32B027/36（15） C08J007/04（15）
B32B009/04（14） B32B027/30（14） B32B007/12（13）
发明人 LEE S（6） JANG B Z（4） JHONG Y（4）
KIM H（4） KIM J（4） LEE J（4）
LIN Y（4） ZHAMU A（4） AKSAY I A（3）
COE W B（3） KIM Y S（3） AKSAY I（2）
CHEN Z（2） CHIU G（2） CHO J（2）
公开年 2021（25） 2016（12） 2022（11） 2014（10） 2011（7） 2015（7） 2023（7） 2012（6） 2010（5） 2019（5） 2009（4） 2013（3） 2017（3） 2020（3）
申请年 2021（18）  2020（12）  2013（9）  2015（9）  2019（9）  2011（8）  2022（8）  2009（7）  2012（6）  2014（6）  2016（6）  2018（4）  2010（3） 
专利权人 NANOTEK INST.（4） SAMSUNG ELEC.（4） UNIV SUNGKYU.（4） AKSAY I A（3）
COE W B（3） POSCO（3） SEKISUI CHEM.（3） SEKISUI CHEM.（3）
BATTELLE MEM.（2） BOEING CO（2） HANKOOK ALUM.（2） HYUNDAI MOTO.（2）
KOREA ALUMIN.（2） NAN YA PLAST.（2） NITTO DENKO .（2） SAMSUNG ELEC.（2）
UNIV MANCHES.（2） UNIV PRINCET.（2） UNIV RUTGERS.（2） UNIV SUNGKYU.（2）

Packaging material used for construct e.g. container, package, and tray for holding, storing, freezing, heating, cooking food products or other products, comprises substrate, and liner includes biopolymer and graphene nanoplatelets.

MCKEOWN M S, GILPATRICK W, SLOAT J T, KENZLO P

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Semiconductive polyolefin composition in power cable, comprises olefin polymer base resin, first carbonaceous structures, carbon black and/or second carbonaceous structures, and optionally additives, where first carbonaceous structures are selected from graphene, and modified graphene.

THEODORIDIS A, MANIKA G, KADAR R, GKOURMPIS T

Hollow carbon fiber tube, formed by winding composite material body, composite material body comprising multiple carbon fiber prepreg layers; and one graphene-containing resin layer, where each of graphene-containing resin layer is disposed between two adjacent carbon fiber prepreg layers.

LI M, LIOU S, LIU S

Production of high temperature composite e.g. carbon-carbon composite, involves pyrolyzing precursor portion produced from resin containing polyaryletherketone at preset conditions, infusing liquid resin and pyrolyzing, and repeating infusion and pyrolysis process.

BARSOTTI R, REBER R, CALVIN M, DIPIETRO S G, MINNICI K, CALVIN M K, BARSOTTI R J

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Thermoplastic rubber comprises crosslinked network of end-of-life tire-derived rubber and at least one complementary polymer, where polymeric matrix encapsulates at least carbon black particles or graphene particles, and thermoplastic rubber is in form of radiation shielding material.

COE W B

Electromagnetic interface (EMI) shielding material comprises polymer matrix and van der Waals material is embedded in polymer matrix, forming quasi-one-dimensional atomic threads, where van der Waals material is trichalcogenide compound.

KARGAR F, BALANDIN A A

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S