国家/地区 日本（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08L（6） C08K（5） H01B（4）
H01L（4） C08G（3） H05K（3）
C01B（2）
IPC C08K003/04（4） C08L063/00（3） C08L101/00（3）
C01B031/04（2） C08K009/04（2） C08L065/00（2）
H01B003/40（2）
发明人 LEE K S（2）
公开年 2012（6）
申请年 2010（2）  2011（2）  2012（2） 
专利权人 SAMSUNG ELEC.（2）

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Electrode, useful in electronic device e.g. organic light-emitting device, organic solar cell or organic memory device, comprises graphene-containing layer, and layer having work function gradient formed on graphene-containing layer.

LEE T, HAN T, AHN J, LEE Y, WOO S, LEE T W, HAN T H, AHN J H, YI Y B, LEE Y B, WOO S H, LI R

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G

Conductive polymer material used in solar cell, organic electroluminescent device, lithium ion battery and super capacitor, comprises conductive polymer and fluorinated graphene.

ZHOU M, ZHONG L, WANG Y

Insulating resin composition for multilayer wiring substrate, includes polymer resin, where oxidation graphene is dispersed in cured product of membranous polymer resin.

SHIM J H, LEE K S, JI S Y

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J