国家/地区 台湾（7）
IPC部 C（7） B（4） H（3）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08K003/04（4） C01B032/182（2） C01B032/184（2）
C08G063/06（2） C08G063/60（2） C08J005/18（2）
C08K003/34（2） C08K005/098（2） C08L067/04（2）
H05K001/03（2）
发明人 JIN R（2） KIM Y S（2）
公开年 2021（7）
申请年 2021（7）
专利权人 TICONA LLC（2）

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Graphene dispersion used in composition for preparing polyurethane composite material, comprises graphene and polyol compound comprising aromatic polyol and modified aromatic polyol made by subjecting the aromatic polyol and epoxidized vegetable oil to ring opening reaction.

CHIEN C, HUNG W, WU Y, JIAN J

Preparing laser light-induced graphene, comprises providing substrate including polyimide or polyetherimide, and adjusting laser light source and far-infrared auxiliary light source to irradiate substrate.

TSENG S, CAI Y

Manufacture of black polyester film for e.g. packaging film, involves physically regenerating portion of recycled polyester material by adding black additive to material and granulating to form pellets, forming chemically recycled polyester pellets, mixing obtained both pellets and melt-extruding.

YUAN C, HSIAO C, YANG C, YANG W, LIAO T

Manufacture of naphthyl silole compound used for preparing graphene nanoribbons, involves reacting brominated/iodinated biphenyl compound with lanthanoid-and-lithium-containing ate complex, and reacting obtained lanthanoid complex with silyl compound.

ITAMI K, ITO H, MATSUSHIMA K, MURAKAMI K, NAKATSUJI H, ISHIDA S

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R