国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08K003/013（7）
发明人
公开年 2021（5） 2022（2）
申请年 2020（4）  2021（2） 
专利权人 EMSCHEM AG（2）

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Polyamide molding composition used as a filled polyamide molding for producing moldings or components of automotive sector, comprises partially crystalline and aromatic polyamide, functionalized impact modifier, metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKANE A, DALBERT A, ALKA A

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Composition for forming composite material, comprises polyaryletherketone copolymer comprising polyetheretherketone containing structural unit and poly(ether diphenyl ether ketone) containing structural unit, and poly(etherimide).

RICH J, ELHIBRI M J, LEACH J, ELHIBRI M

Producing polyurethane foam, comprises dispersing turbostratic graphene in a polymerization solution, and adding second component for polymerizing with the first component to chemically convert polymerization solution into polyurethane foam.

MANCEVSKI V, VLADIMIR M

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Polyamide molding compound for forming molded article, comprises partially crystalline copolyamide comprising 1,6-hexanediamine, 1,3-bis(aminomethyl)cyclohexane, diamine, 1,6-hexanedioic acid and dicarboxylic acid, and filler and additive.

HARDER P, SCHUBERT C, EBLING R, EBLIN J, SCHUBERTH C