国家/地区 中国（69）
IPC部 C（71） H（11） B（10）
G（3）
IPC大类 C08（71）
IPC小类 C08J（71）
IPC C08L079/08（71）
发明人 LI Y（5） LIU G（5） XU Z（5）
LI L（4） ZHANG Q（4） ZHANG Y（4）
BAO X（3） JIN W（3） LIU P（3）
SHI J（3） WANG J（3） WANG Z（3）
YANG Y（3） ZHANG J（3） ZHANG S（3）
公开年 2021（41） 2022（27） 2023（3）
申请年 2021（71）
专利权人 ZHEJIANG ZHO.（7） UNIV SICHUAN（3） CHINA TOBACC.（2） ENANO SHENZH.（2）
FUERDE NEW M.（2） GUANGDONG SU.（2） GUIZHOU AERO.（2） SUZHOU AILEG.（2）

High-smooth and heat-insulating polyimide film useful for motors, comprises e.g. polyamic acid, distilled water, N-methylpyrrolidone, calcium stearate, polyamide resin, polyethylene wax, polyethylene, polyisobutylene, graphene powder, silicon dioxide powder, and calcium carbonate powder.

TIAN B, ZOU W, JIN Y, DING Y

Producing liquid crystalline graphene oxide polyamate composite film, comprises coating the liquid crystal solution containing graphene oxide and polyamic acid in liquid crystal phase, on a substrate, arranging and drying.

YOU N H, RYU J S, YUN L S, JIN J

Preparing ultra-high elastic polyimide fiber/graphene composite gas gel comprises e.g. dispersing polyimide chopped fiber in alkali solution, performing surface modification, mixing graphene solution dispersion liquid with polyimide chopped fiber, dialyzing, freezing and drying.

FENG Y, YIN W, FENG W

Conductive high temperature resistant polyimide composite material comprises surface of conductive fabric prefabricated body, whose surface loaded with nano conductive flocking body and conductive polyimide resin system comprises conductive fillers.

ZHANG H, LI L, WANG G, XIN Y, XU X, YIN X, WANG D, KE H, LI N

Use of conductive ink in reducing the resistivity of a flexible electrode plate after multiple bending, by coating conductive ink on the flexible polar plate under the deformation state, sintering, and spraying solvent, and coating the flexible plate.

YUAN H, YE Y, GUO X, XU X, SUN S, CHEN M, LI W

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Conductive and heat-conducting polyimide film comprises heat conducting coating, conductive layer, adhesive layer, layer base material, and protective film.

XU W

High heat-conducting polyimide film with good film-forming properties comprises aromatic diamine monomer, aromatic dianhydride monomers, heat-conducting filler, film-forming auxiliary materials and polar solvents.

LI X, LAI Z, FENG L, LIANG X, LIU Z, ZHU X

Preparing multi-level structure graphene/polyimide composite sponge useful in e.g. adsorption of pollutant, organic solvent and dyes, comprises e.g. dispersing graphene in deionized water, adding polyethylene glycol, adding silicon dioxide, adding silane coupling agent, and adding diphenyl ether.

HUANG K, QIN J, ZHANG Z, YU P, BAO L

Semi-cured polyimide sheet capable of heat pressing and resistant to high temperature comprises heat conducting filler, a semi-curable resin, a curing agent, an accelerator, zirconium beads, polyimide film, polyimide film and polyethylene terephthalate film.

LAI Z, FENG L, TU Y, LIANG X, LIU Z, ZHU X