国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/04（8）
发明人 WANG L（2）
公开年 2016（3） 2018（2） 2022（2）
申请年 2016（2）  2017（2）  2021（2） 
专利权人

Preparing high-pressure-resistant pipeline plastic involves preparing modified carbon fiber, preparing modified nano particle, adding graphene oxide into absolute ethyl alcohol, soaking completely graphene oxide, and performing ultrasonic treatment to obtain dispersion liquid of graphene oxide.

ZHOU J

Anti-deformation plastic used in a closed ring of aircraft engine, damping block, and buffer block, and in plastic industry, comprises high hardness acrylonitrile butadiene styrene composite material, toughening filler, amino resin, tributyl citrate, compatilizer and silicon dioxide.

WANG L

Semi-conductive shielding material useful for a 220 kV alternating current cable, comprises resin matrix, conductive carbon black, antioxidant, crosslinking agent and modified graphene.

YANG J, TU B, PU D, ZHU C, WEI H, XU J, CHENG M, LUO C, ZHANG L, QIAN Q

Road asphalt comprises petroleum asphalt, compatibilizer, stabilizing agent, antioxidant, flow improver, modified graphene oxide, modified bagasse molecular sieve and styrene butadiene styrene.

XU W, LIU L, YAN X, LI M, PANG Y, HU Y, GUO B, LIU S, HUANG W, FENG Z

Preparation of graphene-doped foam material e.g. foam shoe sole, which involves adding mixture containing graphene-containing pellets into rubber mixing machine to obtain sheet material, and providing material into thermocompressor.

YANG Y

Thermally conductive silicone rubber composite substrate comprises base substrate comprising thermally conductive filler material comprising nickel graphene sheet, nickel-plated carbon nanotubes and carbon fibers and additive.

KE B, KE R, PENG B, WANG L, ZENG M

Composite master batch used for enhancing bioplastic graphene microchips comprises graphite, lactic acid monomer, plasticizer, and compatibilizer.

CHEN Q, CHEN B, ZENG J, YE R

Composite material comprises thermal conductive particles, graphene and organic matrix, where thermal conduction particles are scattered in organic matrix and are bridged through graphene.

GAO C, XU Y, WEI Y