国家/地区 韩国（3） 美国（3） 世界知识产权组织（3）
IPC部 B（6）
IPC大类 B82（6）
IPC小类 C08L（6）
IPC C08L063/00（6）
发明人
公开年 2012（2） 2013（2） 2014（2）
申请年 2012（6）
专利权人

Heat-dissipation composite is obtained by bonding carbon nanotubes with longitudinal direction of growth on nano-graphene plate, attaching carbon hybrid filler with carbon nanotubes, and mixing polymer resin with carbon hybrid filler.

HAN J H, LEE C S, PARK J S, SHIN K W, YU L

Producing graphene based composite material used to e.g. manufacture composite product, comprises introducing graphene and polymeric composition in liquid form into a compounding device, and kneading polymer composition and graphene.

BEAUSOLEIL J, BORDERE S, DELPRAT P, GAILLARD P, KORZHENKO A

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Preparing functionalized graphene, comprises subjecting natural graphite to Friedel-Crafts reaction to obtain modified graphite, extracting, purifying and ultrasonically dispersing in an organic solvent to form a stable graphene suspension.

LIU K, LUO Y, LIU L, JIA D

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Product, useful as a polymer system, comprises a shape memory polymer material, and a graphene material incorporated into the shape memory polymer material to form the polymer system.

XIAO X, XIE T, CHENG Y T