国家/地区 中国（8） 世界知识产权组织（2）
IPC部 C（9）
IPC大类 C08（9）
IPC小类 C08K（9）
IPC C08K007/00（9）
发明人
公开年 2022（7） 2023（2）
申请年 2022（9）
专利权人

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Heat-conducting gel for battery filling, comprises silicone A, thermal conductive filler, cross-linking agent as component A, and silicone B, catalysts, chain extender as component B, and prepared by mixing silicone A, thermally conductive filler and crosslinking agent to obtain component A.

LIN Y, CHEN F, XIANG L, JIANG X

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

New modified lignin dispersant i.e. (4-(3-hydroxy-2-phenoxypropyl)phenol) useful for improving the dispersibility of two-dimensional materials and in thermally conductive cellulose composite film for electronic packaging materials and thermal conductivity materials.

ZHENG Y, QIU X, LIN X, XU S, ZHENG J, QI Y, HU Z, QIN Y, LIU Y

Flexible cellular foam product used for article e.g. mattress, comprises flexible foam substrate, and coating layer comprising highly thermally-conductive nanomaterial, and binder which is at least one chosen from, e.g. acrylic polymer emulsions and styrene-butadiene latex.

STOJANOVIC H, SCHERREY A N, CRAWFORD M L

Preparation of flexible heat accumulation heat-conducting sheet for electronic products, involves mixing and heating flexible base material, heat-conducting filling particles and phase change material, and immersing metal foam in obtained slurry, vacuum defoaming, hot-pressing and curing.

SUN Z, FANG J, REN S

Preparing polyimide composite material with double thermally conductive network comprises e.g. mixing polyamic acid powder, water, triethylamine and first thermally conductive filler, freeze-drying, performing thermal imidization, vacuum-impregnating and hot-pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Flexible heat dissipation material comprises polymer masterbatch modified by hydroxylated boron nitride nanosheets; functionalized graphene; and polymer.

LI X, HE Y, GUO H