国家/地区 日本（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C09K（7）
IPC C08K003/04（4） C09K005/14（3） C09K023/52（2）
发明人
公开年 2022（7）
申请年 2021（4）  2022（2） 
专利权人

Dispersant used in composition for forming conductive material slurry, comprises copolymer comprising an acrylate structural unit, vinyl-based structural unit, and acrylamide structural unit.

AKITO I, YUTARO K, KYOICHI S, IBI A, KINOSHITA Y, SHIROTA K

Dispersion of particles used for controlling surface potential of particles in aqueous solution, comprises particles, polydopamine, and water-soluble polymer containing amino groups, where dispersion is alkaline.

YABU H, MANJIT S G, ABE H, HASHIZUME K, IWAMOTO Y, NAITO K

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Surface modified hexagonal boron nitride particles used for thermally conductive resin composition, have partially reduced graphene oxide adsorption layer on surface of untreated hexagonal boron nitride particle.

ZAIMA H, SUGIMORI S, ONAKA J, ITO G

Heat-dissipating material used in electrical devices, comprises resin, and graphene having preset average thickness, and has preset nitrogen to carbon ratio as measured by X-ray photoelectron spectroscopy.

KATO T, TAMAKI E

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K