国家/地区 韩国（4） 中国（3） 美国（2） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08K（6）
IPC C08K003/04（5） C09K005/14（4） C08K009/02（3）
C08L023/06（2） F21V029/85（2） H05K007/20（2）
发明人
公开年 2021（4）
申请年 2020（6）
专利权人

LED heat dissipation lighting light surface treatment composition useful for street lamp case comprises heat dissipation unit made of aluminum which is formed in multiple body portion and radiates heat generated from lighting module.

WOO L, UK L D

Cooling structure used for cooling article, comprises infrared ray and UV ray absorption and emission layer comprising polymer matrix and conversion material comprising nanoparticles of core-shell structure including core formed of semiconductor material and shell, and visible light reflective layer.

OH S J, LEEHEON, JEON S, SONSUMIN

High heat-conducting graphene floor heating pipe comprises pipe body, polyethylene layer, steel wire net layer, and graphene heat-conducting layer including graphite, antioxidant, dispersant, coupling agent, heat stabilizer, and plasticizer.

XU W, LIU Y, ZHANG H

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y

Base material used for core carrier, is obtained by mixing graphene-coated metal material with modifier chosen from polyethylene, polyvinylidene fluoride, and polyurethane, and wetting film to obtain porous thermal conductive film material.

QIN L, LIANG P, ZHI L, ZHAN Z, CHI S, WANG L, ZHU H