国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C09D（7）
IPC C08K003/04（5） C09D005/24（5） H01B001/24（5）
C09D007/12（4） C09D007/61（4） C09D011/52（4）
C01B031/02（3） C01B031/04（3） C08K009/04（3）
C08L023/06（3） C08L023/12（3） C09D011/037（3）
H01B001/04（3） B29B015/08（2） B33Y070/00（2）
发明人 HASEGAWA S（2） HASEGAWA SHOJI（2） KAMIYA N（2）
KAMIYA NAGISA（2） NAGISA K（2） SHEN Y（2）
SHOJI H（2）
公开年 2015（7）
申请年 2014（5）  2015（2） 
专利权人 GRAPHENE PLA.（2） GRAPHENE PLA.（2）

Method for preparing graphene/poly(3,4-ethylenedioxythiophene) polystyrene sulfonate mixed solution, involves mixing graphene powder and aqueous surfactant followed by dispersing diluted solution to obtain mixed solution.

HU T, LI Y, LEE Y

Graphite-based carbon material used as graphene precursor for preparing graphene dispersion, comprises rhombohedral graphite layer and hexagonal graphite layer, and has specified rate calculated based on X-ray diffraction method.

HASEGAWA S, KAMIYA N, HASEGAWA SHOJI, KAMIYA NAGISA, SHOJI H, NAGISA K, SHEN Y

Method for manufacturing carbon-metal composite, involves reacting composition with specific amount of graphene, providing carbon compound in composition, and providing carbon nanotube with carbon-metal composite.

GONG S Y, LEE S Y, CHOE H, LEE C, LI X, LI Z, CUI X, KONG X, GONG S

New non-covalent modified carbon structure e.g. carbon nanotubes, graphene and graphene nanoplatelets used in manufacture of carbon structure/polymer complex composite.

JUNG Y, YOO H J, KIM J, KIM J S, BYEON C, JUNG Y G, BYEON C S, LIU H

Graphite-type carbon raw material used as graphene precursor, has rhombohedral system graphite layer and hexagonal system graphite layer in ratio more than preset value, as measured using peak intensities specific planes of layers.

HASEGAWA S, KAMIYA N, SHOJI H, NAGISA K, HASEGAWA SHOJI, KAMIYA NAGISA, SHEN Y

Graphene-composite functional material for preparing e.g. piezoresistive material, comprises sulfonated graphene-grafted poly-3,4-(ethylene dioxythiophene).

BAO Y, CHEN S, CHEN Z, WANG J, XU G, YANG C, XING C, ZHOU C, LOU J, ZHU T

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S