国家/地区 中国（78） 韩国（13） 世界知识产权组织（11） 美国（7） 日本（3） 欧洲专利局（EPO）（2）
IPC部 C（99）
IPC大类 C08（99）
IPC小类 C08L（99）
IPC C08K003/04（67） C08J005/18（22） H05K009/00（19）
C08K003/22（18） C08K003/08（14） C08L023/12（13）
C08K009/06（12） C08L023/06（11） C08L023/08（11）
C08L063/00（11） C08K003/36（10） C08K007/06（10）
C08L075/04（10） H01B001/24（9） C08L083/04（8）
发明人 WANG S（8） ZHANG J（8） LI X（6）
WANG Y（6） LIU S（5） WANG J（4）
ZHANG G（4） GAO D（3） HE J（3）
LI N（3） WANG C（3） WANG W（3）
WANG Z（3） XIA J（3） YANG X（3）
公开年 2023（99）
申请年 2022（68）  2021（16）  2023（15） 
专利权人 YANGZHOU NAL.（4） UNIV ZHEJIAN.（3） BEIJING RES .（2） CHANGSHU SHE.（2）
CHINA PETROL.（2） SHENGYI TECH.（2） UNIV INHA RE.（2） UNIV SICHUAN（2）
UNIV ZHEJIAN.（2）

Composition used for light emitting device for intelligent mobile phone, comprises poly(3,4-ethylene dioxythiophene), poly(styrene sulfonate) and sulfur ylide.

XIA S

Nanofield material composition used to prepare thermal interface which is used in field of LEDs, electronic devices, and heat sinks and heat pipes comprises carbon precursor, charge-conducting particles, polymer base, and additives.

NISTA S V G, MENDES L G, MOSHKALEV S, SAVU R

Conductive rubber composition used in article, e.g. tire, tire chimney, wire, sensor, hose, and electromagnetic interference shielding gasket, comprises rubber component, and electrically conductive carbon components.

DENNISPELCHER R V, ZHAO J, MURRAY A P

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Producing thermally stabilized agglomerated lignin-carbon composite material, by providing agglomerated lignin-carbon composite material, and heating agglomerated lignin-carbon composite material to specific temperature to obtain thermally stabilized agglomerated lignin-carbon composite material.

OLSSON V, WALTER S, WACHTLER M, LINDSTROEM M

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

Composition useful in e.g. article, preferably flexible display device of electromagnetic wave shielding film and for transportation devices comprises graphene oxide, nano cellulose, reducing agent comprising hydroxy and amino group.

HONG S W, BAE S, HONG P H, LEE Y, HANUI K, CHOI K W, NO A

Aramid nanofiber wave-absorbing honeycomb material used in stealth aircraft, stealth ships and communication base stations, comprises para-aramid fiber nanofibers and wave-absorbing agent.

ZHANG J, NIE J, TAN J, SONG S, ZHANG M, SUN H, YANG B

Preparing self-generating device in flexible electronic devices, by preparing reduced graphene oxide/polydopamine hydrogel by hydrothermal reduction reaction, adding graphene oxide to deionized water, fixing reduced graphene oxide/polydopamine hydrogel, and encapsulating with assembled electrodes.

TANG C, WANG J, JIANG Y

Heat dissipation film has two-dimensional heat conduction elements assembled in orientation, and is prepared by dispersing two-dimensional heat conduction elements and gel components in water, placing planar substrate that can release charged particles in assembly liquid, and assembling element.

GAO W, ZHAO N, WU Y, BAI H