国家/地区 中国（7） 韩国（2） 世界知识产权组织（2）
IPC部 C（10）
IPC大类 C08（10）
IPC小类 C08K（10）
IPC C08K003/38（10）
发明人 LEE E J（2） LEE K（2） LEE K D（2）
NAM C R（2） SEO M K（2） SONG J（2）
SONG J H（2）
公开年 2023（10）
申请年 2022（8） 
专利权人 HANSOL CHEM .（2）

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Orientation direction adjustable thermal interface material comprises rubber matrix comprising e.g. silicone rubber, acrylic rubber, polyurethane rubber, natural rubber and/or styrene butadiene rubber, two-dimensional sheet filler and 2,2'-(1,4-phenylene)-bis(4-thiol-1,3,2-dioxybenzaldehyde).

WANG J, ZHANG J, FENG Y, LI J, YE N, LU Y

Self-adhesive heat-conducting silicon gel, comprises raw material as polyethylene glycol, modified heat-conducting filler, dimethyl silicone oil and dimethicone coupling agent.

REN B, ZENG X, ZHANG M, JIN L, LI H, LIU H, CHENG X, WU X

High enthalpy value aqueous heat-conducting phase change material comprises paraffin, melamine, ethanol mixture, aqueous polyurethane resin, polyethylene terephthalate release film and heat conducting filler comprising alumina, boron nitride, aluminum nitride or graphene.

LU Q, ZHANG W, SUN B

Hollow micro-sphere composition heat-conducting covered filler by low-dimensional nano-high heat-conducting material useful in heat-conducting aspect, comprises nano-high heat-conducting material comprising electrostatic interaction, chemical bond action and solvent hydrogen bond interaction.

LIU T, HUANG X

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K