国家/地区 世界知识产权组织（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C09K（5）
IPC C08K003/04（4） C08K003/38（2） C08K005/09（2）
C08K009/12（2） C08L063/00（2） C09K005/08（2）
发明人 LEE E J（2） LEE K（2） LEE K D（2）
NAM C R（2） SEO M K（2） SONG J（2）
SONG J H（2）
公开年 2023（5）
申请年 2022（3）  2021（2） 
专利权人 HANSOL CHEM .（2）

Syntactic foam comprises matrix material and multiple microspheres embedded within matrix material, where multiple microspheres comprises metallic glass material.

SINGH A, SHUKLA S

Member used for self-cooling in bed for active magnetocaloric regenerator, comprises heat dissipation sheath, self-cooling material loaded inside heat dissipation sheath and spacer provided on surface of self-cooling tape.

CHAE J G, WOO K, KANG K H, LEE A, CHUNG K C, KIM J W, LEE A Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K