国家/地区 台湾（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C09D（7）
IPC C08K003/04（3） B22F001/00（2） B82Y030/00（2）
B82Y040/00（2） C01B032/182（2） C08K005/00（2）
C09D005/00（2） C09D007/65（2） C09D201/00（2）
H01B001/22（2） H01B001/24（2）
发明人
公开年 2022（3） 2018（2）
申请年 2017（2）  2020（2）  2022（2） 
专利权人

Water absorbing, electrically conductive composition used as sensor for erosion and/or corrosion monitoring, comprises water soluble and/or water swellable and/or water absorbing resin, electrically conductive filler, and solvent.

TATHE D, SHAH J P

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Aqueous sealing layer for sealing microcells of electro-optic devices, comprises water soluble poly(vinylalcohol) homopolymer or poly(vinyl alcohol-co-ethylene) copolymer, and polyurethane.

SARVI A, BERHANE A, AZAGARSAMY M A, PARENT M E, AZAGARSAMY M

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Composition used in forming thin film, comprises chemical contrast pattern having first region of first chemistry on background of second chemistry, and microphase-separated block copolymer material overlying the chemical contrast pattern.

ARNOLD M, JACOBBERGER R, NEALEY P, XIONG S, CHANG T, MA Z, NEALEY P F

Carbon aggregate for produces higher-order carbon substance, comprises two connected multi-walled spherical fullerenes and layers of graphene and coating, where coating is connected with multi-walled spherical fullerenes.

COOK D, GHEZELBASH H, ANZELMO B H, TANNER D, SINGH S

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q