国家/地区 韩国（4） 中国（3） 美国（3） 日本（2） 世界知识产权组织（2）
IPC部 C（6） B（4） H（2）
IPC大类 C08（6）
IPC小类 C08L（6） C08K（4） B82B（3）
B82Y（3） C01B（3） C09D（3）
C08G（2） C08J（2） C09K（2）
IPC C08L063/00（6）
发明人 LIU K（2）
公开年 2013（3） 2012（2）
申请年 2012（6）
专利权人

Heat-dissipation composite is obtained by bonding carbon nanotubes with longitudinal direction of growth on nano-graphene plate, attaching carbon hybrid filler with carbon nanotubes, and mixing polymer resin with carbon hybrid filler.

HAN J H, LEE C S, PARK J S, SHIN K W, YU L

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Preparing functionalized graphene, comprises subjecting natural graphite to Friedel-Crafts reaction to obtain modified graphite, extracting, purifying and ultrasonically dispersing in an organic solvent to form a stable graphene suspension.

LIU K, LUO Y, LIU L, JIA D

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Manufacture of silica nanoparticle-grafted graphene oxide-modified epoxy resin condensate, involves adding silica nanoparticle-grafted graphene oxide to epoxy resin substrate, decompressing, adding curing agent, curing and molding.

LEE S, LING R, LIU K, LU S, QI B, XU X