国家/地区 中国（14）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08K（14）
IPC C08L083/04（14）
发明人 CHEN Y（2）
公开年 2017（10） 2016（2） 2018（2）
申请年 2016（14）
专利权人

Graphene composite rubber material contains nitrile rubber, silicone resin, acrylic resin, sepiolite powder, dicumyl peroxide, barium stearate, diisononyl phthalate, oleyl alcohol polyethenoxy ether phosphate, graphene and dispersant.

INVENTOR U

Preparation of three-dimensional graphene-based microwave absorbing metamaterial substrate used as potential material for stealth weaponry application, involves mixing graphene, additive and rubber, carrying out hot-press molding and drying.

Graphene and alumina binary additive modified grease comprises silicone oil and additive comprising conventional alumina powder and graphene.

SHEN B, SONG D

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Thermal conductive composite material for electronic equipment, contains silica gel, ethylene/butylene terephthalate copolymer, graphene, aluminum powder, polyethylene glycol, titanium dioxide, amylopectin, and antioxidant.

Aluminum nitride-carbon nanowire composite material for LED, contains silicon carbide, aluminum powder, silicon oxide, yttrium oxide, montmorillonite, curing agent, emulsified silicone oil, stearic acid, polyvinyl butyral and graphene.

GUO H, AN D, XIA J, XIAO J, LAI C

Thermally conductive composite material used in e.g. electronic device, contains silicone rubber, ethylene/butylene terephthalate copolymer, graphene, polyethylene glycol, silicon oxide, modified starch, adamantanone and polyaniline.

Glass-fiber-reinforced PA66 power hardware material contains PA66, glass fiber, melamine cyanurate, zinc borate, aluminum hypophosphite, bamboo charcoal, carbon fiber, silicone rubber, aqueous polyurethane, and graphene oxide.

YU W, MA S

Graphene-silicone rubber composite material comprises high phenyl siloxane rubber, graphene, heat conductive filler, silazane and catalyst.

DI L, LIU W, XIA C

High performance and high thermal conductivity composite material used for electronic device, is prepared by adding ethyl silicate, anhydrous ethanol, dilute hydrochloric acid and dimethyldichlorosilane and adding graphene fiber.

YUAN J