国家/地区 美国（60）
IPC部 C（60）
IPC大类 C09（60）
IPC小类 C09K（60） H01B（31） C01B（30）
H05K（24） C08K（19） H01L（17）
B82Y（16） B32B（13） C08J（13）
C09D（11） H01M（11） F28F（10）
C08L（9） B01J（7） C04B（6）
IPC C09K005/14（60）
发明人 JANG B Z（14） ZHAMU A（13） LIN Y（3）
ADAMSON D H（2） CHAN C（2） CHANG H（2）
CHOU T（2） DOBRYNIN A V（2） HSIEH C（2）
HSIEH C Y（2） KIM S H（2） LEE M（2）
LI L（2） LIAO W（2） LIU H（2）
公开年 2015（10） 2021（10） 2014（8） 2016（8） 2017（6） 2019（5） 2022（5） 2018（3）
申请年 2014（10）  2015（8）  2018（8）  2016（7）  2020（7）  2013（6）  2021（6）  2017（3） 
专利权人 NANOTEK INST.（14） JANG B Z（6） ZHAMU A（6） FUJI POLYMER.（3）
AMOGREENTECH.（2） ANJU SCI TE.（2） ENERAGE INC（2） GLOBAL GRAPH.（2）
NITRONIX INT.（2） UNIV CONNECT.（2） UNIV HANYANG.（2）

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Electromagnetic interference (EMI) shielding device has dielectric layer and layer of fillers that have volume overlapped with each other when carbon-based materials are self-aligned in presence of magnetic field.

LIU C, LI W C, CHEN X, KWOK C H, LI W, GUO Z

Hybrid thermal management film, comprises graphene fluoride nanosheets (GFS), and reduced graphene oxide (rGO).

VU M C, KIM S R, KIM S, VU M

Temperature control element used for electrochemical cell, comprises structural elements, anisotropic elements comprising graphite, graphene, carbon nanotubes, crystalline material and/or cohesive powder, and tempering element configured to be in heat transfer relation with electrochemical cell.

RICH D G, HASAN S, WINGER L K, KONG D, LU H, LIU H

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Microelectronic device used in system, comprises microelectronic die, and composite material comprising composite material comprises polymer chain chemically bonded to fill particles comprising hexagonal lattice of carbon atoms.

MATAYABAS J C, BOZORGGRAYELI E, GAINES T, TEJEDA F M E

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Thermal energy-transfer system such as grade beam, comprises thermally conductive concrete comprising carbon, metals and/or conductive polymers, aggregate and cement and having preset compressive strength, and pipes, tubes and capillaries.

GUARRERO B P

Preparation of graphene oxide platelet-filled polyimide film for electronic devices, involves mixing graphene oxide platelets with polyimide precursor material and liquid to form slurry, forming wet film from slurry, and imidizing film.

HSIAO M, ZHAMU A, JANG B Z