国家/地区 美国（45）
IPC部 B（45）
IPC大类 B32（45）
IPC小类 B32B（45）
IPC B32B009/00（21） B82Y030/00（17） B82Y040/00（14）
C09K005/14（13） C01B031/04（12） C08K003/04（12）
H01B001/04（12） C09D005/24（11） C01B031/02（9）
C09D001/00（9） B32B009/04（8） B32B015/08（8）
H05K007/20（8） B32B015/04（7） B05D005/12（6）
发明人 HSIEH C（3） WU M Y（3） WU Y（3）
XIE C（3） CHEN J（2） CHEN J R（2）
HSIEH C Y（2） HSIEH S（2） HSIEH S L（2）
JANG B Z（2） KAGAWA S（2） LEE S（2）
SEIJI K（2） WANG J（2） XIE S（2）
公开年 2021（8） 2014（6） 2015（6） 2009（4） 2012（4） 2011（3） 2016（3） 2022（3） 2010（2） 2013（2） 2017（2）
申请年 2009（6）  2012（6）  2013（6）  2021（6）  2014（5）  2015（4）  2020（3）  2010（2）  2016（2）  2019（2） 
专利权人 ANJU SCI TE.（3） ENERAGE INC（3） BEIJING XICH.（2） KAGAWA S（2）
NANOTEK INST.（2） SEIJI K（2）

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F

Graphene heat-conducting gasket wrapping process involves coating layer of colloid around graphene heat conducting gasket, and forming wrapping layer after curing colloid.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Foil used as surface section, has coating that is nano-coating in which graphene and silicon are present as nanoparticles, such that interaction of molecules or atoms of coating is made with kinetic energy of radiation.

SCHUBART H T

Electromagnetic interference shielding film for flexible printed circuit board, consists of conductive adhesive layer formed using composition comprising acrylate solution, divalent acid ester solution, conductive particles and solvent.

YU P, LIU H, CHANG Y, HUANG S, YOU B, LIU X, ZHANG Y

Secondary battery pouch film comprises sealant layer, adhesive layer formed on sealant layer, primer layer formed on adhesive layer, core layer formed on primer layer and surface layer, where at least one above-mentioned layer has graphene.

HEO C H, PARK Y S, KANG T W, HEO C, PARK Y, KANG T, HEO J H, SOON P Y, KANGTAEWOON