国家/地区 世界知识产权组织（6）
IPC部 C（6）
IPC大类 C09（6）
IPC小类 C09J（6） C08K（3） H01L（3）
H05K（3）
IPC C09J011/04（6）
发明人 ICHIKAWA I（2） ISAO I（2） TAKEO Y（2）
YOSHINOBU T（2）
公开年 2022（6）
申请年 2021（6） 
专利权人 LINTEC CORP（2）

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Roofing system that is free of asphalt, comprises a substrate and an adhesive formulation which comprises filler and/or at least one tackifier, at least one process oil, at least one fire retardant, and at least one polymer.

RUFUS I B, CHICH A, WILLIAMS O, CHIN R, DOUGHERTY M, MERCADO R M L, KRAJCA J L

Bonding two substrates for forming bonded assembly by pre-curing thermoset adhesive using radio-frequency energy, where adhesive comprises radio-frequency susceptor, and subjecting thermoset adhesive to heat treatment.

GREEN M, GREUNER J, VASHISTH A, AUVIL T, SOPHIEA D, MASTROIANNI S, GRUNER J, BASIS A, SOPHIA D

Polyurethane phase change nanocapsule useful for preparing phase change polyurethane pouring sealant, is formed by coating phase change material by amphiphilic block copolymer whose lipophilic end is polyurethane segment and hydrophilic end is methoxypolyethylene glycol segment.

MIAO M, HUANG H, CHEN J, RAO Y, YU Z, SONG J