国家/地区 韩国（9）
IPC部 C（9） F（9）
IPC大类 C09（9）
IPC小类 F21V（9）
IPC C09D007/61（7） F21V029/87（4） F21Y115/10（4）
C08K003/04（3） C09D005/18（3） C09D163/00（3）
F21V029/85（3） C08K003/38（2） C09D201/00（2）
F21V025/12（2） F21V029/70（2）
发明人 KIM S W（2） LIM J J（2）
公开年 2021（5） 2022（4）
申请年 2021（6）  2020（3） 
专利权人 LASER LIGHTI.（2）

Heat-dissipating coating composition useful for producing LED lighting luminaire, comprises carbon nanotubes, epoxy resin, dispersibility improving copolymer, photoinitiator, and thermally conductive material.

PARK J, KWON Y K

LED heat dissipation lighting light surface treatment composition useful for street lamp case comprises heat dissipation unit made of aluminum which is formed in multiple body portion and radiates heat generated from lighting module.

WOO L, UK L D

LED embedded light for e.g. traffic lights, comprises housing component, lighting unit, heat dissipation unit coated with heat dissipation coating layer comprising silica, alumina, resin, cobalt oxide and graphene oxide, and locking fixing unit.

KIM J

Functional lighting lamp, obtained by spraying photocatalyst composition comprising e.g. graphene coating agent, titanium dioxide, tungsten oxide, platinum and silica, and carrying out heat treatment to form coating layer.

PARK J H

Paint composition having excellent heat dissipation effect useful for producing light-emitting diode lighting fixture, comprises aluminum nitride powder, epoxy resin, boron nitride powder, photoinitiator and conductive material.

KIM S W, LIM J J

Double light distribution structure explosion-proof lamp for lighting system, comprises e.g. second light distribution unit located on inner periphery, relatively more protruding than first light distribution unit located on outer periphery.

KIM D S

Lighting fixture e.g. lamp, is applied with heat dissipation composition comprising polymer resin, dispersion stabilizer and thermally conductive filler, which is surface-modified with silane coupling agent after coating with agarose.

SHIN J, SHIM S E

Heat dissipation paint composition for preparing LED lighting fixture comprises boron nitride powder pretreated with ammonia plasma and an epoxy resin.

KIM S W, LIM J J

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z