国家/地区 中国（6）
IPC部 C（6） H（2）
IPC大类 C22（6）
IPC小类 C22F（6） C23C（6） C21D（3）
C01B（2） C25D（2）
IPC C22F001/08（6）
发明人 LI L（2） ZHANG W（2）
公开年 2021（5）
申请年 2021（6）
专利权人

Preparing copper-based graphene useful for preparing copper-based graphene conductor of electric wire cable, comprises performing surface cleaning and drying on copper material, stacking with high temperature resistant substrate, annealing, and growing graphene layer on copper material surface.

FU J, YANG J, SHEN H, ZHANG W, MA Y

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Manufacturing copper alloy for hydrocooling exchangers based on single crystal silicon smelting comprises e.g. preparing furnace material comprising chromium, zirconium, silicon, magnesium, rare earth, and graphene supported cerium powder.

ZHANG Q, ZHANG H, YU G, LI L, MA M, WU B, WANG C, JING L

Method for reducing resistivity of single crystal copper wire, involves annealing single crystal copper under non-oxidizing gas and protective gas atmosphere, introducing carbon-containing gas into copper wire, reacting and cooling.

NOVOSELOV K

Vertical graphene composite heat conducting copper foil comprises copper foil substrate layer adhered with two plane graphene layers at surface and bottom, where surfaces of plane graphene layers have vertical graphene layers.

ZHANG L, YE Q, WANG X, SHEN L

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E