国家/地区 美国（7）
IPC部 C（7）
IPC大类 F28（7）
IPC小类 F28F（6） C09K（4） C01B（3）
F28D（3） B82B（2） C22C（2）
C23C（2） C25D（2）
IPC F28F021/02（5） C09K005/14（4） B82B003/00（2）
C01B032/19（2） C01B032/194（2） C22C009/00（2）
C22C019/03（2） C22C026/00（2） C23C018/16（2）
C25D001/00（2） C25D003/12（2） F28D021/00（2）
F28F021/00（2） F28F021/08（2）
发明人 ZHAMU A（7）
公开年 2019（4）
申请年 2018（4） 
专利权人 NANOTEK INST.（7） JANG B Z（2） WANG M（2） XIONG W（2）
ZHAMU A（2）

Integral graphene film comprises chemically functionalized graphene sheets chemically bonded or interconnected with one another having an inter-planar spacing and non-carbon element.

ZHAMU A, JANG B Z

Metal-bonded graphene foam product used as e.g. heat spreader comprises sheet or roll of solid graphene foam, having sheet plane and sheet thickness direction, composed of multiple pores (cells) and pore walls, and metal.

LIN Y, ZHAMU A, JANG B Z

Metal matrix nanocomposite used as e.g. load-bearing element, comprises metal or metal alloy containing gold and silver as matrix material, and multiple graphene sheet chosen from pristine graphene material or non-pristine graphene material.

ZHAMU A, LIN Y, JANG B Z

Producing metal matrix nanocomposite by preparing graphene dispersion, bringing the graphene dispersion in physical contact with solid substrate surface, and depositing layer of metal or metal alloy onto surfaces of aligned graphene sheets.

ZHAMU A, LIN Y, JANG B Z

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y

Integrated heat sink used in electronic device e.g. battery, camera unit comprises unitary graphene material article composed of heat collection member and heat dissipation member integral to the heat collection member.

ZHAMU A, WANG M, XIONG W, JANG B Z, YIJUN L

Graphene-based heat dissipation system for e.g. portable microelectronic device, has heat-conducting layer comprising sheet of integrated graphene film, which shields component or external surface of electronic device from heat.

ZHAMU A, WANG M, XIONG W, JANG B Z