国家/地区 中国（33） 韩国（4） 美国（4） 德国（2） 台湾（2）
IPC部 F（39）
IPC大类 F28（39）
IPC小类 F28F（30） F28D（23） F24F（4）
H01L（4） B32B（3） F25B（3）
H05K（3） B05D（2） C01B（2）
C23C（2） F24D（2）
IPC F28F021/02（14） F28F021/08（6） F28D015/04（4）
F28D021/00（4） F28F013/18（4） B32B003/26（3）
F24F013/30（3） F28D001/053（3） F28F003/02（3）
F28F009/00（3） F28F021/00（3） F28F021/06（3）
H01L023/373（3） H05K007/20（3） B32B007/12（2）
发明人 CHEN J（3） CAI J（2） CHEN X（2）
GAO Y（2） HAO Z（2） HUANG C（2）
LI C（2） LI J（2） LIU Z（2）
LV J（2） MA Y（2） WANG D（2）
YAO X（2） YU F（2） ZHENG L（2）
公开年 2022（39）
申请年 2021（39）
专利权人 CHANGZHOU CH.（2） GUANGDONG MO.（2） GUANGZHOU DO.（2） HENAN CHENGZ.（2）

Carbon steel material useful for heat sink in electrical and electronic devices comprise carbon steel substrate, and reduced graphene oxide coating layer formed on the carbon steel substrate.

DOW H S

Structural component for e.g. air baffle of vehicle, has structural element and/or coolant channel that has regions consisting of polymer interspersed with carbon elements.

DAHM H, SEIDLITZ H, KUKE F

Phase change energy storage heat exchange device, has heat exchange device connected with water inlet and outlet channel for exchanging cold and hot water with phase change latent heat energy, and transparent end plated with conductive film.

XIAO Z, WANG D, CHEN M

Radiator, has warm air column whose reverse surface is provided with radiating fin for radiating and wall, where width end of radiating plane is transversely set, and plane is surrounded by inner rib and column to form chimney effect.

ZHAO G

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Heat exchanger for wastewater, has module block that is assembled on surface of heat transfer plate, and is fitted in arbitrary area of irregularities formed at regular intervals over entire area of transfer plate.

HO H M

Graphene and carbon nanotube based thermal management device, has heat sink base and heat sink fins comprising single element formed from graphene layers with nanotubes interposed between graphene layers.

GOERGEN J R, ACHKIR D B, CAP M O, DOGRUOZ M B

Bidirectional heat conduction fast graphene capillary tube main body, has graphene whose end is fixedly connected with mechanism, where connecting graphene mechanism on main body of tube is matched with another connecting mechanism.

LIU H, LI X, WANG J, YU F, CHEN X

Graphene flow heat exchanger, has tubular box body provided with spiral graphene cyclone pipe that is surface with set of graphene heat exchange pipes, where inner part of body is provided with water cavity.

LU L