国家/地区 中国（49） 世界知识产权组织（11） 美国（8） 日本（6） 欧洲专利局（EPO）（5） 韩国（4） 台湾（4） 英国（3） 印度（2）
IPC部 B（60）
IPC大类 B32（60）
IPC小类 B32B（60）
IPC B32B009/00（35） B32B009/04（31） B32B033/00（28）
B32B007/12（15） B32B027/36（13） H05K007/20（13）
B32B003/08（12） B32B037/10（11） B32B037/12（10）
B32B003/24（9） H05B003/14（9） H05K009/00（9）
B32B027/02（8） B32B027/32（8） B32B038/00（8）
发明人 LI F（4） ZHANG Y（4） GE X（3）
HE X（3） PAN Z（3） WANG J（3）
ZHANG J（3） ZHOU B（3） CAO Y（2）
CHEN Y（2） DOU L（2） HOU J（2）
LI J（2） LI L（2） LI Y（2）
公开年 2021（60）
申请年 2021（60）
专利权人 HANGZHOU FUX.（3） SHENZHEN HFC.（2） SHENZHEN LEA.（2）

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Forming graphene-infused fiber composite which is used as air frame materials for aircraft, comprises providing graphene consisting of graphene particles in solvent to form mixture and applying mixture to surface of fiber composite layer.

KOZIOL K

Graphene heat conducting film structure for electronic product e.g. smart mobile phone, has plastic film compounded on heat radiation layer, and polyethylene terephthalate protective film attached to plastic film on polymer base body.

TAN X

Electronic product screen based on heat-conducting film structure, has protective outer film that comprises nano-film coating oleophobic layer, nano-silver coating, nano coating and blue-light-proof filter layer.

TAN X

Graphene heat-conducting gasket wrapping process involves coating layer of colloid around graphene heat conducting gasket, and forming wrapping layer after curing colloid.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y

Graphene heat-conducting gasket, comprises multi-layer graphene film, whose adjacent layers are coated with adhesive, graphene film provided with multiple through holes passing through upper and through hole is provided with carbon fiber.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y

Heat transferable biodegradable substrate used for manufacturing moldable interconnect devices (MIDs), comprises first layer comprising poly lactic acid (PLA) matrix dispersed with graphene oxide (GO) particles and second layer.

WINOWLIN J J T, ABHISHEK S, AMEENUDEEN Z, ADAM K M

Device for protecting body from damage, has inner assembly that is adjacent to outer protective cover and comprises thermal energy transfer device adapted to transfer thermal energy to and/or from thermal energy conduction element.

DEVINE S, CHEN S

Integrally formed heating module, has convex strip layer whose bottom surface is provided with gravel layer, where outer wall of heating material layer is fixedly connected with wire, and end of connecting wire is connected with connector lug.

WEI X

High magnetic resistance effect film comprises a winding drum, where the outer surface of the drum is connected with a main body, and the top of the main body is adhered with an ultraviolet blocking layer by a pressure-sensitive adhesive layer.

HUANG Y