国家/地区 日本（8）
IPC部 B（8）
IPC大类 B32（8） C08（8） C09（5）
B29（2） H01（2） H05（2）
IPC小类 B32B（8）
IPC C08K003/04（8）
发明人 KIM Y S（2）
公开年 2021（8）
申请年 2019（4）  2020（3） 
专利权人

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Composite coating composition used for article e.g., plastic film, wire, cable, fiber or sheet of foam, board, paper, wood, or metal comprises binder, high aspect ratio sheet, and low aspect ratio sheet.

SUN L, LACHANCE A M, ZHOU T, LIM Y

Pharmaceutical packaging sheet useful in pharmaceutical packaging material, comprises base layer, adhesive layer formed on base layer, aluminum layer formed on adhesive layer, and resin layer, where all layer includes graphene.

HEO C H, PARK Y S, KANG T W, HEO J H, SOON P Y, KANGTAEWOON, HEO C, PARK Y, KANG T

Aqueous adhesive for manufacture of laminated cellulosic board, comprises water, starch, polymer, glue enhancer, and stabilizing agents, gelling agents, thickener, antifoaming agents, tackifier and/or damp-proofing resins.

ZURUTUZA ELORZA A, ORTEGA MURGUIALDAY A, ALONSO RODRIGUEZ B, ZURUTUZA E A, ORTEGA M A, ALONSO R B, ZURUTUSA E A, ORTEGAMURGIALDEI A, ELORZA A Z, MURGUIALDAY A O, RODRIGUEZ B A

Composite used as film for multilayer film e.g. food packaging material, comprises ethylene modified polyvinyl alcohol and graphene.

KONISHI H, ADACHI M

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E