国家/地区 德国（38）
IPC部 B（38）
IPC大类 B32（38）
IPC小类 B32B（38）
IPC B32B009/00（16） C01B031/02（13） B82Y030/00（10）
B32B009/04（9） C01B031/04（9） B82Y040/00（8）
B32B015/04（7） B32B007/12（6） C08K003/04（5）
C23C016/26（5） H01L021/02（5） H01L029/16（5）
B32B005/02（4） B32B027/08（4） B32B033/00（4）
发明人 ATIAS B（3） LEVI A（3） MENTOVICH E（3）
NAVEH D（3） ADLER U（2） AVOURIS P（2）
BENNAIM Y（2） BURESCH I（2） DANINO S（2）
ELIYA Y（2） LIPP E（2） MAAROUF A（2）
MARTYNA G J（2） MLECZKO L（2） RODE D（2）
公开年 2022（9） 2013（7） 2012（5） 2021（5） 2011（4） 2017（2）
申请年 2011（6）  2022（5）  2020（4）  2021（4）  2010（3）  2013（3）  2002（2）  2009（2）  2012（2）  2019（2） 
专利权人 INT BUSINESS.（6） GM GLOBAL TE.（3） MELLANOX TEC.（3） UNIV BARILAN（3）
FORD GLOBAL .（2） GSI CREOS CO.（2） KME GERMANY .（2） KME GERMANY .（2）
KME GERMANY .（2） MAAROUF A（2） MARTYNA G J（2） NEUTRINO DEU.（2）
PCB TECHNOLO.（2） TYCO ELECTRO.（2） WIELAND WERK.（2）

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Method of depositing two-dimensional material onto target substrate, involves removing starting substrate layer from laminate stack after heat and pressure is applied to form target two-dimensional structure.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A

Electrical steel used as strip e.g. steel sheets, comprises functional layer comprising ferromagnetic material and additional layer comprising non-magnetizable material, which are connected by adhesive bond with atomic diffusion.

FRANKEN C, PLATT J

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Fiber composite material laminate of leaf spring and coil spring of vehicle e.g. passenger car, has intermediate layer that includes composite material with carbon fibers and/or glass fibers and plastic matrix having graphene nanoparticles.

ITALIANO F, GIRELLI C A, BACH A, WESEMANN J, WEZEMAN U, CONSOLARO A G

Multilayer electrode for capacitive pressure sensor of e.g. rotogravure printer, involves press-rolling XY layer and co-extruded layers together for forming multi-layer electrode and printing electrically conductive ink onto polymer layer.

SALTER S C, BUTTOLO P, DELLOCK P K, GALL R, CHASCSA J R, RICHARD G

Polymeric sandwich structure comprises two layers formed from polymer matrix including fiber reinforcing sheet, and third layer formed from third polymer matrix having graphene nanoplatelets.

HUANG X, ZHAO S X

Semi-finished product used for forming foam sandwich structure, comprises cover layer(s) and layer of foamable material comprising carbon and formed by influence of heat, and cured after or during foaming, where foamable material adheres so firmly to cover layer(s) after foaming and curing.

NAGEL M, PORSTMANN S, STEPANOV S, RIEDEL F, TOBERLING G, WILKEN R, KOWALIK T, NIEPEL A