国家/地区 中国（36）
IPC部 B（36）
IPC大类 B32（36） C08（36） B29（6）
C09（4） E04（4） H05（4）
D06（3） H04（3）
IPC小类 B32B（36）
IPC C08K007/14（36）
发明人 CHEN K（3） LI J（3） WANG L（3）
ZHANG J（3） CHEN H（2） CHEN J（2）
HE H（2） LI Y（2） WU H（2）
YU D（2） ZHANG M（2）
公开年 2022（17） 2021（6） 2018（5） 2014（2） 2020（2） 2023（2）
申请年 2022（13）  2020（8）  2017（5）  2021（5） 
专利权人 ENN GRAPHENE.（3） HUIZHOU ZHON.（2） ITEQ WUXI EL.（2） JIANGSU YAO .（2）

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Low dielectric composition useful in laminated plate of printed circuit board, comprises epoxy resin, hardener comprising flame retardant hardener and benzoxazine resin, halogen free flame retardant, accelerator, additive comprising inorganic filler, toughening agent and solvent.

YAO J, GONG J, CHEN S, TANG F

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Preparing X-band stealth/lightning protection skin comprises laying up carbon fiber prepreg, conductive prepreg, wave-absorbing prepreg and wave-transmitting prepreg in sequence on surface of tooling, obtaining first skin, and molding first skin by vacuum bag process.

LI B, SONG Z, WEN Y, LIU Y

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Three-layer composite polypropylene antistatic material useful in e.g. chemical industry and agriculture comprises two layers of antistatic layer and middle layer between two layers of antistatic layer, middle layer made of polypropylene, antistatic layer made of e.g. polypropylene and graphene.

WANG G

Backboard useful in fields of mobile phone backboard, comprises silicone layer, reinforcement layer and polycarbonate layer arranged in sequence from top to bottom, which has ultra-thin thickness, high strength and stain proof.

LIU W, GAN X, XU X, TAO Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Epoxy resin composite material comprises component A and component B that are compounded with each other, where component A includes epoxy resin, preservatives, ultra-fine light calcium carbonate powder, graphene, and component B including carbon fiber mixed cloth woven from carbon fiber threads.

ZHANG W, FEI G, YUAN S