国家/地区 中国（9）
IPC部 B（9）
IPC大类 B32（9）
IPC小类 B32B（9）
IPC F28F021/02（9）
发明人
公开年 2014（3） 2021（2）
申请年 2013（2）  2021（2） 
专利权人

Fluid radiating small volume graphene-aluminum composite dividing wall type heat exchanger, has fixed shell whose inner wall is uniformly distributed with layers of composite heat exchange plates, where support strips are uniformly distributed between adjacent composite heat exchange plates.

FANG R, HU T

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Device for protecting body from damage, has inner assembly that is adjacent to outer protective cover and comprises thermal energy transfer device adapted to transfer thermal energy to and/or from thermal energy conduction element.

DEVINE S, CHEN S

Heating heat exchange tube, has graphene composite layer surrounded into hollow tube, and ethylene vinyl acetate hydroxide layer utilized for maleic anhydride and graphene composite layer, where far infrared outer layer is adhered by co-extrusion.

WANG H

Graphene layer high heat-conducting radiator, has aging-resistant heat-conducting rubber layer directly fixed on outside of adhesive layer, and graphene heat-conducting interlayer directly fixed on outer surface of heat conduction pieces.

LIN R

Radiating fin for use in communication device, has graphene layers provided with multiple plate-shaped graphite particles, and lamellar located between two adjacent plate-shaped graphite particles.

XU Y, JIN L

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A