国家/地区 台湾（8）
IPC部 B（8）
IPC大类 B32（8） F28（6） H01（4）
H05（4） B82（3） C01（3）
C09（2） D01（2）
IPC小类 B32B（8）
IPC B32B009/00（5） B32B009/04（4） B32B015/04（4）
H05K007/20（4） B32B007/12（3） B32B007/02（2）
B32B027/36（2） B82Y030/00（2） B82Y040/00（2）
C01B031/04（2） C09K005/14（2） F28F021/02（2）
H01L023/373（2） H01M010/613（2） H01M010/653（2）
发明人
公开年 2014（2） 2021（2） 2022（2）
申请年 2021（3）  2013（2） 
专利权人

Photothermal conversion material used in photothermal conversion material complex for sewage treatment or seawater desalination, has composite including ultraviolet light and infrared light absorbing material is selected from group consisting of tungsten oxide, titanium oxide, copper sulfide.

ASTER A T, NASEEM S, WU C, TESSEMA A A

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Assembly for a battery, includes thermal management multilayer sheet equipped on surface of an electrochemical cell, and thermal management multilayer sheet comprising thermally-insulating layer.

CHURCHILL C, DAIGLE R C, KILHENNY B, DAGLE R

Remote heat exchanging module for e.g. portable computer, has heat generated by heat source transferred to second end of second heat conduction element sequentially through the first heat conduction element, and dissipated out of remote heat exchanging module through the heat dissipation element.

LIAO W, LIN K, LIN G

Natural graphite/copper composite heat sink, has copper foil layer formed on graphite layer, copper substrate formed with roughening layer, and nodule copper grain structure formed with graphene layer.

LIU B

Manufacture of carbon macrotube used for forming e.g. structural materials used in aerospace components, involves providing at least one layer of graphene, and wrapping at least one layer of graphene around scaffold material.

MCHUGH F J, MALLORY R C

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K