国家/地区 台湾（9）
IPC部 B（9） C（8） H（6）
F（2） G（2）
IPC大类 B32（9） H01（6） C09（5）
H05（4） B82（2） C01（2）
C23（2） G06（2）
IPC小类 B32B（9）
IPC B32B009/00（3） H01L023/373（3） H05K007/20（3）
B32B015/04（2） B32B015/08（2） B32B027/28（2）
B32B033/00（2） B82Y030/00（2）
发明人
公开年 2022（9）
申请年 2021（9）
专利权人

Photothermal conversion material used in photothermal conversion material complex for sewage treatment or seawater desalination, has composite including ultraviolet light and infrared light absorbing material is selected from group consisting of tungsten oxide, titanium oxide, copper sulfide.

ASTER A T, NASEEM S, WU C, TESSEMA A A

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Composite coating system used for e.g. outdoor coatings, comprises primer comprising primer composition including first resin and carbon nanotubes, and topcoat comprising topcoat composition including second resin and graphene.

SUN C, LI P, CHANG W

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Adhesion promoting layer for depositing conductive layer on inorganic or organic-inorganic hybrid substrate to form conductive structure, includes metal oxide layer containing metal oxide and chelating agent, arranged on inorganic or organic-inorganic hybrid substrate, and interface layer.

HUANG M, WANG W, CHANG Y

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F