国家/地区 韩国（5） 印度（2） 世界知识产权组织（2）
IPC部 C（8）
IPC大类 C01（8）
IPC小类 C01B（8）
IPC C01B032/19（3） C01B032/194（3） C01B032/21（3）
C08K003/04（3） H05K007/20（3） C08L075/04（2）
C09D011/52（2） C09J007/28（2） C09J011/04（2）
发明人 CHOI S（2） KWON H J（2） SONG J（2）
YUMINSOOK（2）
公开年 2023（8）
申请年 2021（8）
专利权人 PURE MANN IN.（2）

Method for fabricating two-dimensional channel transistor involves growing hexagonal-boron nitride layer on substrate, selectively etching hexagonal-boron nitride layer by exposing hexagonal-boron nitride layer to sulfur hexafluoride plasma gas, and treating etched layer in potassium hydroxide.

SHRIVASTAVA M, RAWAT J S, MEERSHA A

Production of silver particle-graphene composite material used for heating device, involves adding N-methyl-2-pyrrolidone, and stirring, exfoliating and dispersing wet graphite to preparing graphene-containing composition, adding silver particles, and exfoliating and dispersing.

LIM K, NOH C, IMKIHYUN, ROH C

Method for generating white light using white light-emitting quantum dots, involves mixing naphthalene and heteroatom co-doping compound, fabricating heteroatom co-doped graphene quantum dots from obtained mixture, and generating white light using obtained white-light emitting quantum dots.

SAGAR V K, BISHT P B

Heating pad in heatable garment, comprises graphene particles dispersed in polymer matrix material, and electrically insulating covering layer bonded to heating pad and electrically insulating covering layer, overlaying and bonded to heating pad.

JONES E O, HOWE T H, SEYMOUR J

Polydimethylsiloxane composite for heat dissipation/flame retardancy in field of automobiles and electrical/electronic comprises metal hydroxide-coated carbon body as filler based on polydimethylsiloxane.

SHIM S E, HWANG S, SO J, LEE K

Manufacturing heat dissipation sheet using graphene useful for electric or electromagnetic devices comprises preparing dispersion having graphene or graphene oxide, adsorbing metal salt to graphene or graphene oxide by adding metal salt.

JIN K

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK