国家/地区 中国（4） 韩国（4） 美国（2）
IPC部 C（7） B（3） H（2）
IPC大类 C01（7）
IPC小类 C01B（7）
IPC C09J011/04（7）
发明人
公开年 2022（2）
申请年 2014（2）  2021（2） 
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H

Photothermal adhesive composition for fabrication of a microfluidic chip, comprises graphene-transition metal compound composite.

CHOI H W, LEE J M, KIM Y J, LIM J H, CHUNG B G, JEA K Y, LEE J

Preparing graphene heat dissipation film, involves adding epoxy acrylic resin, performing emulsification treatment, centrifuging, pouring, cutting adhesive sheet, adhering to graphene sheet with bioadhesive and pressing sheet.

CHEN Z, MIAO L, ZHANG C

Preparing graphene-aqueous polyurethane composite material involves adding sulfuric acid in dry beaker and mixing graphite, sodium nitrate and potassium permanganate under magnetic stirring for two hours to obtain mixture.

WANG Y

Preparing graphene oxide based curing agent used for epoxy resin composite material comprises e.g. using Hummers method, adding e.g. graphite in flask, adding sulfuric acid, reacting, cooling, drying to obtain pre-oxidized graphite.

LI Z, LIU F, SONG Y, GUO R, GUO K

Graphene ball conductive adhesive preparation by preparing polymer microsphere using monomer mixture, performing chemical vapor deposition to grow graphene on microsphere surface, and dispersing graphene ball into epoxy resin glue system.

CHEN Y, LI J, LI Y, ZHANG X, LEE Y