国家/地区 韩国（3） 美国（3） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C01（6） H01（6） B32（2）
B82（2）
IPC小类 C01B（6）
IPC H01L021/265（6）
发明人
公开年
申请年 2009（2） 
专利权人 POSTECH ACAD.（2）

Manufacturing semiconductor useful in filed of power conversion devices, electric and electronic systems, comprises e.g. implanting dopant into semiconductor, capping material into two-dimensional honeycomb, and heat treating.

KIMSEONGJUN, KANG M J, SHIN H K, LEE N S, JAE P Y, SUNG M J

Preparing directly layer of controllable graphene on insulating substrate comprises forming insulating substrate on first metal layer, injecting carbon ions, forming second metal layer on surface of first metal layer and annealing.

DI Z, WANG Z, WANG G, ZHENG X, DAI J, XUE Z, ZHANG M, WANG X

Manufacturing method of silicon carbide semiconductor device, involves forming protective layer on silicon carbide substrate into graphene, activating impurity, and removing protective layer.

KYEONG K C

Preparing graphene-layered structure e.g. epitaxial structure that is useful in e.g. transistor, by implanting nitrogen and oxygen ions on surface of silicon carbide thin film to form ion implantation layer and heat treating the film.

SHIN H, CHOI J, AHN J, SEO J, AHN J R, CHOI J Y, SEO J T, SHIN H J

Manufacturing structure comprising semiconductor substrate and modified graphene layer, comprises supplying initial structure comprising standard graphene layer, and hydrogenating initial structure with exposure dosage of hydrogen gas.

CHIANG S, ENRIQUEZ H, OUGHADDOU H, SOUKIASSIAN P, TEJEDA G A, VIZZINI S, TEJEDA GALA A, GALA A T

Creating layers of graphene, comprises implanting carbon atoms into a substrate at first temperature and lowering temperature of the substrate, so that the carbon atoms diffuse from substrate.

RAMAPPA D A, SULLIVAN P, RAMAPPA D