国家/地区 中国（7）
IPC部 C（7）
IPC大类 C01（7）
IPC小类 C01B（7）
IPC C01B032/194（4） C01B032/186（2）
发明人 LIU Z（7）
公开年 2021（4） 2022（2）
申请年 2021（7）
专利权人 UNIV PEKING（7）

Transferring method of film graphene, involves attaching side of graphene film/silicon resin layer/organic adhesive layer/graphene film composite to target substrate, and removing organic adhesive layer with organic solvent, removing metal substrate to obtain polymer film/silicon resin /glue layer.

LIN L, DING Q, ZHONG H, LIU Z

Method for transferring single crystal wafer graphene film to target substrate e.g. silicon sheet, involves removing heat release adhesive tape and each adhesive layer in composite layer after drying obtained heat release tape/auxiliary support layer/terpenoid small molecular layer.

LIU Z, XIE Q, CAI A, YAN R, WANG M, GAO X, LIN L, ZHENG L, HU Z, PENG H

Graphene film used in flexible film electronic and optoelectronic device such as touch screen, solar battery, organic LED and sensor, has specific wrinkle density.

XIE Q, LIN L, MA J, SONG Y, DING Q, ZHANG Y, LIU Z

Carrier for batch preparation of graphene film comprises supporting plates for placing substrate for growing graphene, heating plates for heating substrate, and electrode assembly connected with heating plates.

ZHU Y, MA Z, GAO X, SHAN J, JIA K, PENG H, LIU Z

Method for forming graphene-substrate composite structure, involves fixing substrate through chemical vapor deposition chamber continuously at certain rate, where chemical vapor deposition in chemical vapor deposition chamber is deposited on substrate.

QI Y, CHENG Y, LI J, SHI P, LIU Z

Method for preparing graphene glass fiber, involves providing glass fiber with conductive carbon layer on surface, and applying pulse current to glass fiber with conductive carbon layer on surface to obtain graphene glass fiber.

LIU Z, CHENG Y, SHI P, LI J, QI Y

Transferring graphene film comprises e.g. providing first graphene composite structure, removing base layer of first graphene composite structure to obtain second graphene composite structure, and removing buffer layer.

PENG H, GAO X, ZHENG L, LIN L, LIU Z, HU Z, YAN R, YANG H