国家/地区 美国（7） 中国（5） 韩国（4） 日本（3） 世界知识产权组织（3） 台湾（2）
IPC部 B（7）
IPC大类 B32（7） B82（7） C01（7）
B29（3） H01（3） B41（2）
B44（2） C03（2） C23（2）
IPC小类 B32B（7）
IPC B32B038/10（7）
发明人 CHO S（2） CHO S H（2） IM H Y（2）
JIANG K（2） LIN X（2） SONG Y（2）
SONG Y I（2） WON D（2） WON D K（2）
公开年 2012（4） 2011（2）
申请年 2011（7）
专利权人 HANWHA TECHW.（3） SAMSUNG TECH.（3） HON HAI PREC.（2） HONGFUJIN PR.（2）
UNIV TSINGHU.（2）

Formation of patterned graphene layer on substrate used for low-noise amplifier, involves forming patterned structure(s) of carbide-forming metal or metal-containing alloy on substrate, applying layer of graphene and heating.

AFZALIARDAKANI A, MAAROUF A, MARTYNA G J, SAENGER K, AFZALIARDAKANI A C O I

Making thermoacoustic element involves arranging graphene film on metal substrate/forming laminate structure by stacking nonmetal substrate on substrate/removing substrate from laminate structure/forming through-holes in nonmetal substrate.

JIANG K, LIN X, XIAO L, FAN S, IM H Y, FAN F Y

Transfer method of graphene film for manufacture of transparent conductive film for e.g. display, involves bonding substrate and layer(s) of graphene film formed on another substrate using adhesive resin layer containing volatile substance.

KIMURA N, SHIMIZU K, FUKUDA T

Graphene transferring method involves compressing catalyst metal film and substrate film using initial roller, and separating substrate film from metal film.

NA D, YOON J, SONG Y, WON D, NA D H, YOON J H, SONG Y I, WON D K, YUAN D

Making transmission electron microscope grid comprises e.g. applying carbon nanotube film structure to a graphene layer to obtain a graphene layer-carbon nanotube film composite structure, and placing the composite structure on a grid.

LIN X, FENG C, ZHANG L, JIANG K, IM H Y, ZHANG L N

Manufacturing method of graphene transfer film involves applying air pressure to at least one of graphene growth film and carrier film so that graphene and carrier film are attached to each other.

CHO S, SONG Y, CHO S H, SONG Y I

Method for transferring graphene from graphene forming structure onto desired object e.g. circuit substrate, involves separating oxide layer from metal catalyst layer and removing metal catalyst layer by using etching solution.

CHO S, WON D, CHO S H, WON D K