国家/地区 中国（30）
IPC部 C（30） H（30） B（9）
IPC大类 C01（30）
IPC小类 C01B（30）
IPC C01B032/184（13） H05K007/20（11） C01B032/194（10）
H05K009/00（10） C01B032/19（7） B82Y040/00（5）
C01B032/198（4） B82Y030/00（3） C01B032/182（3）
C09K005/14（3） H05B003/14（3） B01J013/00（2）
B32B007/12（2） B32B009/00（2） B32B009/04（2）
发明人 WANG J（3） CHEN Q（2） GUO L（2）
GUO S（2） HOU M（2） LI Y（2）
LIU C（2） LIU J（2） LIU Z（2）
WANG X（2） WANG Y（2） YANG S（2）
ZHANG L（2） ZHANG P（2）
公开年 2023（30）
申请年 2022（21）  2023（7）  2021（2） 
专利权人 INST COAL CH.（2）

Graphene/MXene composite aerogel material has three-dimensional porous structure and MXene sheet layer attached to thin graphene sheet.

LIU C, ZHANG P, LEI D, LIU J, LI Y

Heating rod for use in intelligent heating barrel, has graphene heating film coated on periphery of insulating column, and conductive layer not completely covered on graphene of heating film and connected with power supply through lead.

CHAO W, ZHAO X

Atomic force microscope based graphical method, involves emitting titanium dioxide beam emitted by UV laser beam on probe on same area as ultraviolet laser beam, so that oxidation graphene area is reduced to be graphene, and to form graphene pattern.

WANG M, LIU C, YAO S, PENG X, ZHANG Z

Three-electrode coaxial DBD device with special-shaped structure for reducing graphene oxide, has openings on both sides of special-shaped glass tube along length direction are respectively sealed and connected with sealing and fixing plug.

FANG Z, CUI X, GUO S, ZHU Y, YU W, GUO L, HUANG J

Heat dissipation sheet useful for display component comprises heat dissipation layer formed of polymer sheet containing graphene particles, and first adhesive layer located on top of heat dissipation layer.

YOO T H, LEE J, JOH B J, PARK M W, PARK M, CHO B, LIU T

Synthesizing graphene oxide grafted with p-cyanophenyl azo useful for providing wave-absorbing material, comprises adding oxidized graphene into water, adjusting pH of solution, adding prepared diazonium salt solution, stirring, heating, coupling, cooling, filtering, drying and purifying.

NI M, ZHANG C

Preparing graphene heat dissipation film, involves obtaining graphite dispersion, adding liquid resin and film-forming agent into mixed dispersion, placing graphite conductive sheet in sulfuric acid solution, adding liquid resin into graphene water dispersion solution and peeling off metal substrate.

HONG J, YE J, LIU M, HUANG W, LIN J

High-strength graphene heat-conducting gasket in thermal interface material field, has stacking direction of graphene heat-conducting layer is perpendicular to stacking direction of graphene film in any layer of graphene heat-conducting layer.

WANG H, FANG X, SUN A, YANG S, CAO Y

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Activation method before metallization of thick copper printed circuit board hole involves preparing graphene liquid and graphene oxide liquid, mixing to obtain graphene copper plating pre-activation liquid without dispersant, and injecting activating solution.

BAI J, XIE D, FANG B, WANG J