国家/地区 韩国（5）
IPC部 C（5）
IPC大类 C01（5） B01（2） C09（2）
H05（2）
IPC小类 C01B（5）
IPC C01B032/19（5）
发明人 CHOI S（5）
公开年 2022（2） 2023（2）
申请年 2020（2）  2021（2） 
专利权人 ELEMENT CO L.（3） PURE MANN IN.（2）

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Continuous mass production of graphene using thermal plasma comprises, generating plasma by injecting, injecting expandable graphite and intercalation graphite, exfoliating graphene by expanding expanded graphite, and drying by hot air.

KYOUNGJEONGBAE, HWAN B J, CHOI S

Continuous mass production of graphene comprises injecting inert gas into plasma apparatus to generate plasma, injecting expandable graphite and intercalation graphite, expanding by thermal plasma treatment and cooling collected graphene.

KYOUNGJEONGBAE, CHOI S, NGUYENDINHHUONG

Continuous mass-production of graphene using thermal plasma without using graphite oxide and acid and without reduction process, comprises e.g. generating plasma by injecting inert gas into plasma device and exfoliating graphene.

KYOUNGJEONGBAE, CHOI S, NGUYENDINHHUONG, NGUYEN D H, CHOI S H, BAE K J, CUI X, BAE K, CHAE S H, NGUYEN D F