国家/地区 欧洲专利局（EPO）（6）
IPC部 C（6）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC C01B032/05（3） C01B032/194（3） C01B032/21（3）
C01B032/914（2） C01B033/02（2） C04B035/14（2）
C04B041/45（2） H01M004/36（2） H01M004/38（2）
H01M004/62（2）
发明人
公开年 2021（4） 2022（2）
申请年 2021（6）
专利权人

Tantalum carbide-coated carbon material for e.g., LED manufacturing equipment, comprises a carbon substrate, and a tantalum carbide coating layer formed on the carbon substrate.

JO D W, CAO D, WAN J, CHO D W

Forming carbon foam used for composite carbon foam by blending the carbon source with a solvent to form a mixture, heating the mixture at atmospheric pressure and in a non-oxidizing atmosphere to produce a carbon foam precursor, and heating the precursor at atmospheric pressure.

ATKINS C A, YURCHICK C L, TARGETT M

Preparation of silicon-carbon composite material used as anode material in battery cell, involves mixing silicon particles, carbon compound, and dispersant, thermally processing mixture, and heat-treating thermally processed intermediate product preset temperature.

GENTISCHER H, BIRO D, HABERZETTL P, DREWS M, HORZEL J, DOLD L, HARBOR J P, DRUCE M, HOSEL J

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Silicon-silicon composite oxide-carbon composite used for negative electrode active material for lithium secondary battery, comprises core-shell structure comprising core comprising silicon, silicon oxide compound, and magnesium silicate, and shell comprising carbon layer, and has preset span value.

LEE E, PARK H, LIM S W, OH S M, LIM J C, HUNSOO P, IMSUNGWOO, LIM J