国家/地区 中国（16） 韩国（3） 日本（2） 台湾（2）
IPC部 C（18） H（5） B（3）
IPC大类 C08（18） C09（4） H01（4）
C01（2）
IPC小类 C08G（18）
IPC C08G073/10（18）
发明人 LIAO B（3） QIAN X（3） ZHANG B（3）
公开年 2020（7） 2021（7） 2022（4）
申请年 2020（18）
专利权人 ZHUZHOU TIME.（3）

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Preparing high temperature resistant polyimide useful for manufacturing flexible display substrate, comprises e.g. carrying out suction filtration and vacuum defoaming of polyamic acid resin solution, casting on casting plate, solidifying into adhesive film.

QIAN X, LIAO B, ZHANG B

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Producing polyimide aerogel used for three-dimensional model conveniently in various fields i.e. food, comprises e.g. preparing polyamic acid salt by dissolving diamine, dianhydride and tertiary amine-based photocuring agent in solvent.

CHUNG C M, CHOI Y J, CHOI J Y, JIN S W, PARK H J, SEUNGHYOUN L, LEE J S, LEE J, AHN H S, KIM D

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Composition for forming composite material, comprises polyaryletherketone copolymer comprising polyetheretherketone containing structural unit and poly(ether diphenyl ether ketone) containing structural unit, and poly(etherimide).

RICH J, ELHIBRI M J, LEACH J, ELHIBRI M

Flame-retardant and wave-absorbing polyimide foam material comprises an electric loss type/magnetic loss type wave absorbing composite material that is compounded in polyimide foam.

ZHOU G, NIE H, HUANG Z, GU M, ZHOU H

Preparing functionalized cross-linked polyimide aerogel heat insulation material useful in high-end thermal insulation materials and other fields comprises adding cross-linking agent into container, adding nitric acid and stirring.

CUI S, SONG Z, WANG X, ZHAO Y, HUANG L, LIU W, YUAN M

High dielectric polyimide film comprises polyimide and graphene oxide uniformly filled in the polyimide.

XU J

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J