国家/地区 中国（5） 美国（2）
IPC部 C（6）
IPC大类 C08（6） B32（2） C09（2）
IPC小类 C08G（6）
IPC C08K003/36（6）
发明人
公开年 2022（4） 2023（2）
申请年 2022（6）
专利权人

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Preparing nanoparticle-modified resin matrix based on direct ultrasonic dispersion method useful for resin or composite material forming, comprises e.g. adding curing agent to main resin, adding nanoparticles, immersing ultrasonic horn in resin mixture, and dispersing nanoparticles.

MA Z, FENG Z, YANG Y, LI L

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Polyvinyl chloride pipe useful for e.g. water supply of tap water, comprises polyvinyl chloride resin, talc powder, calcium-zinc stabilizer, silicon dioxide, lubricant, titanium dioxide, ethylene-methyl methacrylate copolymer, solid plasticizer, aging-resistant filler and impact modifier.

XU R, WANG Y

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H