国家/地区 中国（14） 美国（2）
IPC部 C（17）
IPC大类 C08（17） B29（3） C09（3）
B32（2）
IPC小类 C08G（17）
IPC C08K003/04（17）
发明人 BELCHER M A（2） CONNELL J W（2） GHOSE S（2）
ZHANG J（2）
公开年 2022（17）
申请年 2021（10）  2022（7） 
专利权人 BOEING CO（2）

Impregnated resin material useful for densification and modification of carbon fiber paper and proton exchange membrane fuel cell, obtained by in-situ polymerization of surface-modified conductive carbon and phenolic resin.

LIANG Y, XIE Z, HE C, ZHAN Z, WANG Y, LEI T

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Anti-deformation composite anti-fatigue pad useful as indoor sports pad and kitchen floor mat, comprises e.g. foaming material including polyether polyol, polyester polyol, polymethylene polyphenyl polyisocyanate, non-ionic polyisocyanate, diphenylmethane diisocyanate and cellulose nanocrystals.

SHAO J, SONG J

Composite material comprises matrix comprising polyphenylene sulfide, and filler including carbon material doped with sulfur, dispersed in matrix.

KOO B C, SIK C, PARK J Y, YOU N H, RYU J S

Peeling graphene useful in preparing graphene flexible film, comprises mixing graphite powder, bio-based graphene dispersant and deionized water evenly, and peeling off mechanically to obtain graphene dispersion.

LIU J, YANG J, WU Q, WU M, ZHU Y, ZHANG J

Graphene multifunctional insole comprises insole main body comprising base pad body, graphene conducting layer and ventilation layer, ventilation hole arranged on ventilation layer, and heat conducting reinforcing block embedded on conducting layer.

FU X

Preparing thermally conductive filler for highly thermally conductive elastomer comprises e.g. adding composite thermally conductive material and grafted graphene oxide to mixed solvent of ethanol and water, ultrasonically dispersing, grinding, transferring to reaction vessel, and precipitating.

LIU Y, ZHONG R, LI T

Polyimide precursor solution comprises modified silica microsphere, graphene oxide, diamine compound and dianhydride solution where modified silica microsphere is prepared by using silica powder as carrier, adding pure water under protection of inert gas to obtain initial product.

YUAN B

Modified epoxy resin, comprises epoxy resin, curing agent, graphene oxide grafted with carbon nanotubes, silane coupling agent, initiator, organosilicone and solvent.

ZHU X

Anti-deformation plastic used in a closed ring of aircraft engine, damping block, and buffer block, and in plastic industry, comprises high hardness acrylonitrile butadiene styrene composite material, toughening filler, amino resin, tributyl citrate, compatilizer and silicon dioxide.

WANG L