国家/地区 中国（24） 美国（6） 世界知识产权组织（4） 欧洲专利局（EPO）（3） 韩国（3） 日本（2） 台湾（2）
IPC部 B（29）
IPC大类 C08（29） B32（10） B29（8）
B01（6） C09（5） B33（4）
B82（3） G01（3） B60（2）
C01（2）
IPC小类 C08G（29）
IPC C08K003/22（29）
发明人 LI H（2） QU Z（2） WANG S（2）
YAO Y（2） YUAN X（2）
公开年 2022（8） 2021（7） 2016（3） 2017（2） 2018（2） 2020（2） 2023（2）
申请年 2020（10）  2021（4）  2022（4）  2017（3）  2015（2）  2016（2）  2019（2） 
专利权人 CHONGQING JI.（2）

Preparing in-situ polymerized polyester composite material with powder added online comprises e.g. mixing and beating dihydric alcohol, dibasic acid and auxiliary materials, then ultrasonically filtering, mixing and dispersing uniformly powder and product, and carrying out polycondensation reaction.

ZHU Y, SHAO X, LIANG Y, SONG C, ZHOU L, JIANG Y

Preparing hydrogel for energy storage device, involves forming pre-gel comprising polymer and metal salt particles, shrinking and dehydrating pre-gel and impregnating shrunk and dehydrated pre-gel with ion solution to cross-link and rehydrate shrunk and dehydrated pre-gel to produce hydrogel.

JI D, KIM J Y, HWAN J D

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Preparing heat-pressing molding foam absorbing material involves mixing raw materials comprising components, foam type surfactant, wave absorbing agent, catalyst and water to form to-be aggregate raw material, where wave absorbing agent is carbon black, graphite, carbon nano tubes and graphene.

YANG R, ZHAO Z, LIU R

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Composite material used for forming structural material, comprises closed cell polyurethane matrix portion exhibiting properties associated with wood, and particulate portion homogeneously distributed and suspended in matrix portion, where particulate portion is fiberglass and hemp fiber.

CHRISTY J, ESCOBAR H

Furan-based nano-composite copolyester material useful in bottle material, packaging, high-performance fiber and engineering plastic, comprises copolyester substrate (comprised of 2,5-furan dicarboxylic acid, dihydric alcohol copolymerization) and two-dimensional nano material.

WANG R, JIANG M, LI L, ZHOU G

Composite material useful for fiber winding, comprises bisphenol A type epoxy resin, toughening epoxy resin, wetting agent, active diluent, hydrophobic modified nano filler, coupling agent, antifoaming agent, latent curing agent, accelerator and wetting dispersant.

QIU S, DENG H, ZHENG S, HUANG B, LI G, LIN W