国家/地区 中国（19） 美国（4） 世界知识产权组织（4） 日本（2） 韩国（2）
IPC部 C（22）
IPC大类 C08（22）
IPC小类 C08G（22）
IPC C08L079/08（22）
发明人 CHEN C（2） HUANG T（2） WANG D（2）
XU Z（2） YANG L（2） ZHAO J（2）
ZHAO X（2） ZHOU H（2）
公开年 2021（6） 2020（3） 2022（3） 2017（2） 2019（2） 2023（2）
申请年 2020（5）  2021（4）  2011（2）  2018（2）  2019（2）  2022（2）  2023（2） 
专利权人 UNIV JILIN（2） ZHEJIANG ZHO.（2）

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Blended polyamic acid solution used in lithium-ion battery pole piece, comprises rigid polyamic acid, flexible polyamic acid and polar solvent, where rigid polyamic acid is formed by condensation polymerization of rigid dibasic acid anhydride and rigid diamine.

WU D, TIAN G, XU Y, WANG Y, QI K, QI S

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

High heat-conducting insulating radiating fin useful for energy battery in mobile phone, flat computer and layer of heat-conducting radiating film, comprises thermally conductive layer and a thermally conductive insulating layer connected to the thermally conductive layer.

ZHOU Z, ZHU Q, ZHENG Z

Transparent polyimide composite conductive film comprises silver nanowire layer and graphene oxide layer attached to transparent polyimide base film surface.

JIN W, XU Z, QUE X

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q

Composite material useful for electronic device, preferably galvanic cell, supercapacitor, or fuel cell, comprises polyamide-imide, and nanoplatelets.

HODGE S A, GALHENA D T L, GALHENA D T L G

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

High heat-conducting four-needle-shaped composite particle/polyimide film useful in electronic materials e.g. thermal management materials and interface materials, comprises heat-conducting filler, surfactant and polyamic acid solution.

MA C, CHI H, LIU D, ZHANG P, DAI P