国家/地区 中国（26） 世界知识产权组织（9） 韩国（7） 美国（7） 日本（5） 欧洲专利局（EPO）（4） 台湾（3） 澳大利亚（2） 加拿大（2） 印度（2）
IPC部 B（32） C（32） H（7）
D（2）
IPC大类 B32（32）
IPC小类 B32B（32）
IPC C08K003/04（32）
发明人 CHO J（2） LEE K（2） LEE K N（2）
WU D（2） ZHANG Y（2）
公开年 2022（7） 2018（5） 2017（4） 2019（3） 2020（3） 2021（3） 2010（2） 2015（2）
申请年 2019（5）  2020（5）  2018（4）  2022（4）  2016（3）  2021（3）  2014（2）  2015（2） 
专利权人

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N

Graphene/polyethylene naphthalate (PEN)/polyethylene terephthalate (PET) composite barrier film for e.g. food packaging, has three-layer structure comprising layer made of PET, and layer made of graphene/PEN/PET composite material.

WU Z, CHEN X, LIN Y, WU D, CHEN D

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Electromagnetic interface (EMI) shielding material comprises polymer matrix and van der Waals material is embedded in polymer matrix, forming quasi-one-dimensional atomic threads, where van der Waals material is trichalcogenide compound.

KARGAR F, BALANDIN A A

Graphene multifunctional insole comprises insole main body comprising base pad body, graphene conducting layer and ventilation layer, ventilation hole arranged on ventilation layer, and heat conducting reinforcing block embedded on conducting layer.

FU X

Preparing heat-pressing molding foam absorbing material involves mixing raw materials comprising components, foam type surfactant, wave absorbing agent, catalyst and water to form to-be aggregate raw material, where wave absorbing agent is carbon black, graphite, carbon nano tubes and graphene.

YANG R, ZHAO Z, LIU R

Conductive powder used for forming coating material for forming electrode, comprises conductive polymer powder containing (pi)-conjugated conductive polymer and polyanion, and graphene.

MATSUBAYASHI S, TAKEZAWA Y

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L