国家/地区 中国（20） 美国（11） 韩国（8） 台湾（8） 世界知识产权组织（8） 欧洲专利局（EPO）（5） 日本（5）
IPC部 C（27） H（27） B（8）
D（3） F（2） G（2）
IPC大类 C08（27）
IPC小类 C08G（27）
IPC C08K003/04（27）
发明人 CHEN S（3） CHI S（2） JI S Y（2）
JIN R（2） KIM S（2） KIM S H（2）
KIM Y S（2） ZOU H（2）
公开年 2022（7） 2020（4） 2021（4） 2023（3） 2013（2） 2015（2） 2019（2）
申请年 2021（9）  2019（4）  2020（4）  2014（2）  2022（2） 
专利权人 SAMSUNG ELEC.（3） TICONA LLC（2）

Composition useful in e.g. article, preferably flexible display device of electromagnetic wave shielding film and for transportation devices comprises graphene oxide, nano cellulose, reducing agent comprising hydroxy and amino group.

HONG S W, BAE S, HONG P H, LEE Y, HANUI K, CHOI K W, NO A

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Automatic temperature-limiting heating cloth comprises temperature-limited heating wire, electrode connecting belts, and laminating film layer, where electrode connecting belt are connected with positive and negative electrodes of power supply.

PENG Y, SHAO M

Electromagnetic interface (EMI) shielding material comprises polymer matrix and van der Waals material is embedded in polymer matrix, forming quasi-one-dimensional atomic threads, where van der Waals material is trichalcogenide compound.

KARGAR F, BALANDIN A A

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Preparing ultra-light polyurethane imide material porous comprises e.g. adding pyromellitic dianhydride and methanol to dimethylformamide to dissolve, adding conductive carbon material castor oil, ionic water, silicone oil, tertiary amine catalyst and organic tin catalyst and stirring.

WU Q, SHI R, LI C, QIN L, ZOU H, LV X, YAO A, SHU Q

Electromagnetic shielding polypropylene composition used for auto component products comprises metal-organic frameworks-porous carbon material, polypropylene resin, toughening agent, talcum powder and processing additive.

GUO W, XIONG Z, CHEN S, CHEN Y, LAI A, HE L, YE N, CHEN P, FU W