国家/地区 台湾（8）
IPC部 C（8）
IPC大类 C08（8） C09（5） H01（2）
IPC小类 C08G（8）
IPC C08K003/22（8）
发明人 FUJIMOTO T（4） MANDAL S（3） KONWAR D B（2）
MILLER C（2） RAJENDRA V（2）
公开年 2022（6）
申请年 2020（5） 
专利权人 MOMENTIVE PE.（4）

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Addition curable silicone-imide composition for cured silicone-imide material for e.g., aerospace device, comprises alkenyl functional siloxane-imide copolymer, alkenyl functional organosiloxane, polyorganohydrogensiloxane and catalyst.

MILLER C, NARAYANAN R, ZAMPELLA J, RAJENDRA V, FUJIMOTO T, MANDAL S

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Insulated thermal interface material for applying between electronic element e.g. central processing unit, and thermal dissipating element, comprises base including polymer, and filler including graphene dispersed in base.

LING Y, WANG C, LIU J, LING Y C, WANG C P, LIU J Y