国家/地区 中国（25） 韩国（7） 世界知识产权组织（5）
IPC部 C（35）
IPC大类 C08（35）
IPC小类 C08K（35）
IPC C08K003/04（35）
发明人 ZHANG J（3） BAI Y（2） CHEN L（2）
DAI M（2） GAO D（2） HONG X（2）
HU B（2） LIU S（2） LIU Y（2）
LV Y（2） NIE J（2） PAN Z（2）
QUAN H（2） REN Y（2） XU M（2）
公开年 2023（35）
申请年 2022（23）  2021（8）  2023（4） 
专利权人 BEIJING RES .（2） CHINA PETROL.（2） UNIV ZHEJIAN.（2）

Producing porous composite hydrogel useful for electromagnetic interference shielding, comprises mixing vinyl-based monomer and crosslinking agent, adding carbon-based material to mixture, and forming porous composite hydrogel.

SOHN D, QUYEN V T, NO T

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

Composition useful in e.g. article, preferably flexible display device of electromagnetic wave shielding film and for transportation devices comprises graphene oxide, nano cellulose, reducing agent comprising hydroxy and amino group.

HONG S W, BAE S, HONG P H, LEE Y, HANUI K, CHOI K W, NO A

Aramid nanofiber wave-absorbing honeycomb material used in stealth aircraft, stealth ships and communication base stations, comprises para-aramid fiber nanofibers and wave-absorbing agent.

ZHANG J, NIE J, TAN J, SONG S, ZHANG M, SUN H, YANG B

Heat dissipation film has two-dimensional heat conduction elements assembled in orientation, and is prepared by dispersing two-dimensional heat conduction elements and gel components in water, placing planar substrate that can release charged particles in assembly liquid, and assembling element.

GAO W, ZHAO N, WU Y, BAI H

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Composition used for forming film heater, comprises binder resin containing resol phenolic resin, conductive particles comprising carbon nanotubes, adhesion enhancer comprising polyvinyl acetal, and heat resistance enhancer comprising silsesquioxane powder.

KIM Y J, YOU G J, JANG S H, KIM H J, PARK G H, HONG B K, YOONJIN K, YU G, HYUN C, PARK K H

Preparing wave-absorbing material comprises dispersing graphene oxide and polyaniline in water to obtain solution A, dissolving divalent iron salt and trivalent iron salt in water and mixing with solution A, heating, adding reducing agent, centrifuging, dispersing composite material in water.

LUAN X, YUAN X

Heat dissipation material used in heat dissipation of heat generating devices, comprises graphene, silver nanoparticles and polyvinylidene fluoride, where graphene vinyl is modified and dispersed in polyvinylidene fluoride, and silver nanoparticles are adsorbed on graphene surface.

HU B, GUO H, LI B