国家/地区 世界知识产权组织（11）
IPC部 C（11）
IPC大类 C08（11） C09（5） H01（5）
H05（4） B82（3） C01（3）
IPC小类 C08L（11）
IPC C08L101/00（11）
发明人
公开年 2021（5） 2022（5）
申请年 2021（11）
专利权人 KYOCERA CORP（2）

Member used for self-cooling in bed for active magnetocaloric regenerator, comprises heat dissipation sheath, self-cooling material loaded inside heat dissipation sheath and spacer provided on surface of self-cooling tape.

CHAE J G, WOO K, KANG K H, LEE A, CHUNG K C, KIM J W, LEE A Y

Composition for forming article e.g. seals, comprises matrix polymer chosen from thermoplastic polymer and curable polymer having functional group for crosslinking, and three-dimensional, branched and/or crosslinked carbon nanostructure additive provided in amount such that after forming article.

REICHL G, GUREVICH E, PERIYASAMY M, QUARTAPELLA C J, PIACENTE N P, LYNN B

Plastic case useful in vehicle component chosen from battery, electrical wire, power supply device, and housing of electrical component, comprises plastic housing comprising plastic composite and functional filler, and thin film coating formed on portion of surface of plastic housing.

SHIN C M

Graphene dispersion used for forming graphene resin powder for battery, comprises graphene and polymer dispersed in solvent, and has preset viscosity measured using B-type viscometer at preset rotating speed.

KUME A

Making composite matrix, comprises mixing ingredients comprising carbon nanotubes and inorganic surfactants to generate treated mixture, and mixing ingredients including treated mixture and polymers to generate polymer-based mixture.

ZIEBELL R A, WELLMAN W

Thermoplastic resin composition for manufacturing conductive member, is obtained by melt-kneading at least thermoplastic resin, carbon nanostructure, and graphene or carbon black having specific Brunauer-Emmett-Teller (BET) specific surface area.

YUKI K, TOMOHIRO M, MONMA T, KANDA Y

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R